DiTEC Polishing Compound - Fine Cut - 32oz [PC-CMPD-FCO2]
Product Details
Polishing Compound - Fine Cut - 32oz
This advanced fine cut, anti-hologram polish removes polishing haze and swirl marks for a 100% hologram-free finish. Featuring next-gen, self-grinding alumina abrasives, it's safe for all paint types - fresh, cured, and scratch-resistant. Water-based, silicone- and solvent-free.
Features:
- Effectively removes holograms
- Free of solvents and silicone
- Appearance: Cream/Paste
- Solubility: N/A
- pH: 8
Use & Application:
For the DiTEC Fine Cut Compound, we recommend using the DiTEC Red Trapez foam polishing pad.
Application: Apply a sufficient amount of the polishing compound to the polishing pad or to the painted surface. Spread the compound at a low speed (about 1000 rpm) on the defect and at about 1600 rpm using moderate pressure.
Specifications:
- Type: Restoration & Compounds
- Box Dimensions: 3"H x 3"W x 10"L WT: 2.35 lbs
- UPC: 850019168440
Owner's Manual (pdf)
Brochure (pdf)
Care & Maintenance
To maintain the beauty and integrity of your purchase, we recommend treating it with care. Simple maintenance practices, such as gentle washing and proper storage, can effectively preserve the longevity of your favorites. We encourage you to refer to the care instructions included with each item, designed to help you keep your purchase in top condition.
Size & Fit
Our products are crafted to fit true to size, ensuring that you can confidently select your usual size with ease. Whether you’re looking for a relaxed or tailored fit, our designs are made to complement your unique shape and style.